Light emitting device package having lead electrode with varying height

ABSTRACT

A package for mounting a light emitting element includes: a first lead electrode defining a portion of a bottom of a recess and comprising a base member and a plating disposed on the base member, and wherein the first lead electrode comprises, in a plan view: a first region, a second region surrounding a periphery of the first region, wherein, in a height direction, an upper surface of the base member in an entirety of the second region is higher than an upper surface of the base member in the first region, and a third region surrounding at least a portion of a periphery of the second region, wherein, in the height direction, an upper surface of the base member in the third region is lower than the upper surface of the base member in the entirety of the second region; a second lead electrode; and a resin molded body.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of U.S. patent application Ser. No.16/249,782, filed on Jan. 16, 2019, which is a divisional of U.S. patentapplication Ser. No. 14/978,670, filed on Dec. 22, 2015, which claimspriority to Japanese Patent Application No. 2014-263695, filed on Dec.25, 2014. The disclosures of these applications are hereby incorporatedherein by reference in their entireties.

BACKGROUND 1. Technical Field

The present disclosure relates to a package, a light emitting device,and methods of manufacturing the package and the light emitting device.

2. Description of the Related Art

Various types of light emitting devices using a light emitting elementand methods of manufacturing the same have been developed. For example,JP 2014-29995 A discloses a light emitting device having a linearprotrusion at a lead frame, and a method of manufacturing the lightemitting device. Also for example, JP 2004-274027 A and JP 2005-353914 Aeach disclose a light emitting device in which a portion of a lead frameforming a bottom surface of a recess is recessed to place a lightemitting element therein, and a method of manufacturing the lightemitting device.

Meanwhile, a method of manufacturing a light emitting diode (hereinafterreferred to as an “LED”) includes molding a package, and an LED ismanufactured through the molding step. In manufacturing an LED, transfermolding has been typically employed, in which a lead frame is set in amold and liquid resin is injected. However, with such a method ofmanufacturing an LED, the resin flows into a gap between the lead frameand the mold, which may result in the generation of resin burrs. Suchresin burrs may cause a bonding failure of LED elements and/or wires, sothe burrs must be removed. Accordingly, in conventional manufacturing ofan LED, the molding is always followed by removing burrs.

In such a method of manufacturing an LED, examples of ways to preventgeneration of resin burrs include optimizing conditions in the molding,increasing the pressing force of the mold, reducing the number of LEDsmolded with a single lead frame, increasing the viscosity of resin toreduce flowability or the like.

Further, JP 2014-29995 A discloses that, in a lead frame provided with aplating layer on its surface, burrs can be reduced by allowing theplating layer to rise and protrude at the border of a portion where ametal portion is desired to be exposed (a LED mounting portion, a wirebonding portion).

The mold disclosed in JP 2014-29995 A is provided with a projectionhaving a shape corresponding to a recess of a package. Accordingly, themold has the following structure. When the lead frame is clamped, theprojection of the mold abuts and is pressed against a linear protrusionformed by plating raised at the boundary of the LED mounting portion orthe like. Thus, entry of resin which will become burrs is prevented.

However, in the method of manufacturing disclosed in JP 2014-29995 A,the width of the linear protrusion is small, so that formation of theprotrusion on the lead frame is difficult.

In the light emitting device and the method of manufacturing the samedisclosed in JP 2004-274027 A and JP 2005-353914 A, in order tofacilitate control of the directivity of light and to improve thelight-extracting efficiency, a portion of the lead frame forming thebottom surface of the recess is further recessed. Thus, neither of thesedisclosures discloses preventing the generation of burrs. Accordingly,the methods disclosed in JP 2004-274027 A and JP 2005-353914 A areinsufficient to prevent generation of burrs.

SUMMARY

The embodiments of the present disclosure provide a package and a lightemitting device in which generation of burrs is suppressed, and methodsof easily manufacturing the package and the light emitting device whilesuppressing generation of burrs.

A package for mounting a light emitting element according to certainembodiments of the present disclosure include a recess; a first leadelectrode having, in a plan view, a first region, a second regionsurrounding a periphery of the first region and having a width of 110 μmor more and a thickness greater than that of the first region, and athird region surrounding at least a portion of a periphery of the secondregion and having a thickness smaller than that of the second region,the first lead electrode forming a portion of a bottom surface of therecess; a second lead electrode arranged spaced apart from the firstlead electrode and forming a portion of the bottom surface of therecess; and a resin molded body that fixes a portion of the first leadelectrode and part of the second lead electrode, and forms at least aportion of a lateral surface of the recess.

Further, a light emitting device according to certain embodiments of thepresent disclosure includes the package and a light emitting elementmounted on the first region.

Still further, a method of manufacturing a package for mounting a lightemitting element according to certain embodiments of the presentdisclosure includes providing a first lead electrode and a second leadelectrode, the first lead electrode having, in a plan view, a firstregion, a second region surrounding a periphery of the first region andhaving a width of 110 μm or more and a thickness greater than that ofthe first region, and a third region surrounding at least a portion of aperiphery of the second region and having a thickness smaller than thatof the second region, the first lead electrode and the second leadelectrode respectively forming a portion of a bottom surface of arecess; forming a package including the first lead electrode, the secondlead electrode, and a resin molded body, the package having a recess,the step of forming the package including using a mold having an uppermold part having a projection with a shape corresponding to the recessand a lower mold part on which the first lead electrode and the secondlead electrode are to be placed; placing the first lead electrode andthe second lead electrode in predetermined positions on the lower moldpart so that the first lead electrode and the second lead electrode areset between the upper mold part and the lower mold part and that thesecond region abuts the upper mold part; pressing the upper mold partagainst the first lead electrode and the second lead electrode;injecting a resin into the mold that is in contact with the first leadelectrode and the second lead electrode; curing the injected resin toharden the resin molded body; and removing the upper mold part from thelower mold part.

Still further, a method of manufacturing a package for mounting a lightemitting element according to certain embodiments of the presentdisclosure includes providing a first lead electrode and a second leadelectrode, the first lead electrode having, in a plan view, a firstregion, a second region surrounding a periphery of the first region andhaving a width of 110 μm or more and a thickness greater than that ofthe first region, and a third region surrounding at least a portion of aperiphery of the second region and having a thickness smaller than thatof the second region, the first lead electrode forming a portion of abottom surface of a recess, the second lead electrode having, in a planview, a fourth region, a fifth region surrounding a periphery of thefourth region and having a width of 110 μm or more and a thicknessgreater than that of the fourth region, the sixth region surrounding atleast a portion of a periphery of the fifth region and having athickness smaller than that of the fifth region, the second leadelectrode forming a portion of the bottom surface of the recess; forminga package including the first lead electrode, the second lead electrode,and a resin molded body, the package having a recess, and the step offorming the package including using a mold having an upper mold parthaving a projection with a shape corresponding to the recess and a lowermold part on which the first lead electrode and the second leadelectrode are to be placed, placing the first lead electrode and thesecond lead electrode in predetermined positions on the lower mold partso that the first lead electrode and the second lead electrode are setbetween the upper mold part and the lower mold part and that the secondregion and the fifth region abut the upper mold part, pressing the uppermold part against the first lead and the second lead electrode;injecting a resin into the mold that is in contact with the first leadelectrode and the second lead electrode; curing the injected resin toharden the resin molded body; and removing the upper mold part from thelower mold part.

Still further, a method of manufacturing a light emitting deviceaccording to certain embodiments of the present disclosure includesmanufacturing a package for mounting a light emitting element accordingto the method of manufacturing a package and mounting the light emittingelement on the first region.

In the package and the light emitting device according to theembodiments of the present disclosure, generation of burrs can besuppressed. Further, the methods of manufacturing a package for mountinga light emitting element provide easy manufacturing of a package and alight emitting device in which generation of burrs is suppressed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a cross section of a light emittingdevice according to a first embodiment.

FIG. 2 is a schematic diagram of a cross section of the light emittingdevice according to the first embodiment taken along line II-II in FIG.1.

FIG. 3 is a schematic diagram of a top view of the light emitting deviceaccording to the first embodiment.

FIG. 4 is an enlarged sectional view of part H in FIG. 2.

FIG. 5 is a schematic diagram of a perspective view showing an entirelight emitting device according to a second embodiment.

FIG. 6 is a schematic diagram of a cross-section of the light emittingdevice according to the second embodiment taken along line VI-VI in FIG.5.

FIG. 7 is a schematic diagram of a top view of the light emitting deviceaccording to the second embodiment.

FIG. 8 is a schematic diagram of a top view of a lead frame in a step ofmanufacturing the light emitting device according to the secondembodiment.

FIG. 9 is a schematic diagram of a top view of a lead frame in a step ofmanufacturing the light emitting device according to the secondembodiment, taken along line IX-IX in FIG. 8.

FIG. 10 is a schematic diagram showing an arrangement of lead electrodesand the mold at the position corresponding to line VI-VI in FIG. 5 in astep of manufacturing the light emitting device according to the secondembodiment.

FIG. 11 is a schematic diagram of a cross-section showing the leadelectrodes placed between and held by the upper mold part and the lowermold part, in a step of manufacturing a package for mounting a lightemitting element according to the second embodiment.

FIG. 12 is a schematic diagram of a cross-section of a package afterremoving the mold, in a step of manufacturing the package according tothe second embodiment.

FIG. 13 is a schematic diagram of a top view of a package after removingthe mold, in a step of manufacturing the package according to the secondembodiment.

FIG. 14 is a schematic diagram of a cross-section showing a state inwhich a light emitting element is mounted, in a step of manufacturingthe light emitting device according to the second embodiment.

FIG. 15 is a schematic diagram of a second region formed by etching inthe light emitting device according to the second embodiment.

FIG. 16 is a schematic cross-sectional view showing a state of thesecond region before and after being placed between the upper mold partand the lower mold part and pressed by the mold, in a package accordingto the second embodiment.

FIG. 17 is a schematic cross-sectional view showing a relationshipbetween the second region provided with a metal portion and a sealingmember in the light emitting device according to the second embodiment.

FIG. 18 is a schematic diagram of a cross-section of lead electrodesprovided with lateral surface protrusion portions respectively accordingto Variation 1.

FIG. 19 is a schematic diagram of a top view of the lead electrodesprovided with lateral surface protrusion portions respectively accordingto Variation 1.

FIG. 20 is schematic a cross-sectional view of the second regionprovided with a groove, showing a state before and after being placedbetween the upper mold part and the lower mold part and pressed by themold according to Variation 2.

FIG. 21 is a schematic diagram of a cross-section of a light emittingdevice according to Variation 3 in which a die-bonding member is filledin a region for mounting a light emitting element.

DETAILED DESCRIPTION OF EMBODIMENTS Embodiment

In the following, embodiments will be described with reference to thedrawings. The embodiments described below each exemplify a lightemitting device for embodying the technical idea of the presentinvention, and the technical idea of the present invention is notlimited to that described below. Further, the size, material, shape,relative arrangement and the like of constituent components described inthe embodiments are not intended to limit the scope of the presentinvention thereto unless otherwise specified, and they are merelyexamples. Note that, the size, positional relationship and the like inthe drawings may be exaggerated for the sake of clarity.

First Embodiment

FIG. 1 is a schematic diagram of a cross section of a light emittingdevice according to a first embodiment. FIG. 2 is a schematic diagram ofa cross section of the light emitting device according to the firstembodiment taken along line II-II in FIG. 1. FIG. 3 is a schematicdiagram of a top view of the light emitting device according to thefirst embodiment. FIG. 4 is an enlarged sectional view of part H in FIG.2.

The light emitting device 1 includes a package 90, a light emittingelement 2, wires W, and a sealing member 40.

The package 90 includes a pair of lead electrodes 20 and 30 made ofmetal plates, and a resin molded body 10. The package 90 is providedwith a recess 10 a for mounting the light emitting element 2. The pairof lead electrodes 20 and 30 are exposed at the recess 10 a.

The shape of the whole package 90 is a substantially rectangularparallelepiped. At the upper surface of the package 90, the cup-shapedrecess (a cavity) 10 a for mounting the light emitting element 2 isformed. The package 90 is integrally retained by the resin molded body10 such that the pair of lead electrodes 20 and 30 made of metal platesare exposed outside the resin molded body 10 and on a bottom surface 10c of the recess 10 a.

The resin molded body 10 fixes part of the first lead electrode 20 and aportion of the second lead electrode 30, and forms at least a portion ofa lateral surface 10 b of the recess 10 a. Further, the resin moldedbody 10 is formed such that the first lead electrode 20 and the secondlead electrode 30 are interposed between two sides of the rectangle in aplan view. Thus, the resin molded body 10 fixes the first lead electrode20 and the second lead electrode 30, spaced apart from each other, tothe bottom surface 10 c of the recess 10 a.

The height, length, and width of the resin molded body 10 can beselected as appropriate in accordance with the purpose and the intendeduse. Examples of the material of the resin molded body 10 includethermoplastic resin and thermosetting resin. The thermoplastic resin maybe, for example, polyphthalamide resin, liquid crystal polymer,polybutylene terephthalate (PBT), unsaturated polyester or the like. Thethermosetting resin may be, for example, epoxy resin, modified epoxyresin, silicone resin, modified silicone resin or the like.

The recess 10 a is defined by the lateral surface 10 b and the bottomsurface 10 c with a shape of an elliptical frustum narrowing toward thebottom surface 10 c. The light emitted by the light emitting element 2is reflected by the lateral surface 10 b. The light can be condensed ordiffused by changing the angle of the lateral surface 10 b asappropriate. The bottom surface 10 c is made up of the first leadelectrode 20, the second lead electrode 30, and a gap 10 e that is partof the resin molded body 10. The gap 10 e is provided between the firstlead electrode 20 and the second lead electrode 30 such that the firstlead electrode 20 and the second lead electrode 30 are notshort-circuited.

In order for the lateral surface 10 b of the recess 10 a to efficientlyreflect light, the resin molded body 10 may contain a light reflectivemember. The light reflective member is a material exhibiting high lightreflectivity, such as white filler of titanium oxide, glass filler,silica, alumina, zinc oxide or the like. A visible light reflectivity of70% or more, preferably 80% or more is preferable. In particular, areflectivity of 70% or more or 80% or more in the wavelength band oflight emitted by the light emitting element is preferable. The contentof titanium oxide or the like may be from 5 weight % to 50 weight %inclusive, and preferably from 10 weight % to 30 weight % inclusive.However, the embodiments of the present invention are not limitedthereto.

The first lead electrode 20 refers to a lead portion positioned insideand under the resin molded body 10 in a plan view. The shape of thefirst lead electrode 20 is substantially a quadrangle in a plan view.However, the shape thereof is not limited thereto, and the first leadelectrode 20 may be partially provided with a cutout, a recess, aprojection or the like.

The second lead electrode 30 refers to a lead portion positioned insideand under the resin molded body 10 in a plan view. The shape of thesecond lead electrode 30 is substantially a quadrangle in a plan view.However, the shape thereof is not limited thereto, and the second leadelectrode 30 may be partially provided with a cutout, a recess, aprojection or the like.

The first lead electrode 20 and the second lead electrode 30 arearranged as being spaced apart from each other by the gap 10 e of theresin molded body 10, and used as the anode electrode and the cathodeelectrode when the light emitting device is in use.

Note that, herein, though the first lead electrode 20 is formed to belonger than the second lead electrode 30, the length, width, andthickness of the first lead electrode 20 and the second lead electrode30 are not particularly limited, and can be selected as appropriate inaccordance with the purpose and the intended use. The first leadelectrode 20 and the second lead electrode 30 are formed usingelectrically conductive material such as iron, copper, phosphor bronze,copper alloy or the like. Further, in order to enhance reflectivity oflight from the light emitting element 2, the first lead electrode 20 andthe second lead electrode 30 may be metal-plated with gold, silver,copper, aluminum or the like.

The first lead electrode 20 forms part of the bottom surface 10 c of therecess 10 a. In a plan view, the first lead electrode 20 has a firstregion R1, a second region R2 that is thicker than the first region R1,and a third region R3 formed at least at part of the outer circumferenceof the second region R2 and being thinner than the second region R2.

The first region R1 is the portion where the light emitting element 2 isbonded by die-bonding. The second region R2 is formed at the boundarybetween the portion where the light emitting element 2 is bonded and theresin molded body 10 in the first lead electrode 20.

Specifically, part of the second region R2 is formed along the lateralsurface of the resin molded body 10 forming the lateral surface 10 b ofthe recess 10 a, and part of the second region R2 is formed along thegap 10 e connecting the first lead electrode 20 and the second leadelectrode 30.

The lateral surface 10 b of the recess 10 a is connected continuously toan outer corner portion of the second region R2. That is, in across-sectional view, the lower portion of the lateral surface 10 b ofthe recess 10 a is in contact with the position of the outer cornerportion of the second region R2, such that the upper surface of thesecond region R2 and the lateral surface 10 b of the recess 10 a arecontinuous to each other.

The third region R3 has the same thickness as the first region R1.

The second lead electrode 30 forms part of the bottom surface 10 c ofthe recess 10 a. The upper surface of the second lead electrode 30 isflat, and partially provided with the resin molded body 10.

Herein, the second region R2 is annularly formed so as to surround theregion for mounting the light emitting element 2. The region formounting the light emitting element 2 specifically refers to the regionin the first lead electrode 20 exposed at the bottom surface 10 c of therecess 10 a (hereinafter referred to as the “light emitting elementmounting region”).

The second region R2 can be formed by subjecting the base materialitself of the metal plates to work. In the present embodiment, a samematerial is employed for the pair of lead electrodes 20 and 30 and thesecond region R2, and the second region R2 is integrally formed with thepair of lead electrodes 20 and 30.

A width A1 of the second region R2 is 110 μm or more. By setting thewidth A1 of the second region R2 to 110 μm or more, the second region R2can be easily formed. Further, in manufacturing the light emittingdevice 1, when the width A1 of the second region R2 is 110 μm or more,and resin is injected into the mold, provided that the resin flows ontothe upper surface of the second region R2, the resin tends to stopmidway on the upper surface of the second region R2. Accordingly, theresin will not easily flow to reach the metal exposed portion on thefirst lead electrode 20, and the effect of suppressing generation ofresin burrs is enhanced. In order to more easily achieve theabove-described effects, the width A1 of the second region R2 ispreferably 120 μm or more, and more preferably 130 μm or more.

Note that, the metal exposed portion on the first lead electrode 20 isthe portion on the first lead electrode 20 at the bottom surface 10 c ofthe recess 10 a excluding the second region R2.

Further, the width A1 of the second region R2 is preferably 200 μm orless. In manufacturing the light emitting device 1, when the width A1 ofthe second region R2 is 200 μm or less, the pressing force is moreeasily centered at the second region R2 when the pair of lead electrodes20 and 30 are pressed by the mold. In order to more easily achieve theabove-described effect, the width A1 of the second region R2 is morepreferably 190 μm or less, and further preferably 180 μm or less.

Note that, the width A1 of the second region R2 is the width excludingthe thickness of a plating layer. Further, as will be described later,the thicknesses of metal portions 14 formed by the second region R2being crushed are not included.

Preferably, the difference between the thickness of the first leadelectrode 20 at the first region R1 and the thickness of the first leadelectrode 20 at the second region R2 (hereinafter referred to as the“thickness difference”) B1 is from 5 μm to 50 μm inclusive. Inmanufacturing the light emitting device 1, when the thickness differenceB1 between the first region R1 and the second region R2 is 5 μm or more,as will be described later, and the pair of lead electrodes 20 and 30are pressed by the mold, the possibility of the upper mold part beingbrought into contact with the metal exposed portion of the first leadelectrode 20 becomes smaller. On the other hand, when the thicknessdifference B1 between the first region R1 and the second region R2 is 50μm or less, the thickness of the entire pair of lead electrodes 20 and30 can be reduced. In order to more easily achieve the effect describedabove, the thickness difference B1 between the first region R1 and thesecond region R2 is more preferably 10 μm or more, and furtherpreferably 15 μm or more. Further, in order to further easily achievethe above-described effect, the thickness difference B1 between thefirst region R1 and the second region R2 is more preferably 45 μm orless, and further preferably 40 μm or less.

Note that, the thickness difference B1 between the first region R1 andthe second region R2 in the light emitting device 1 is the thicknessdifference between the first region R1 and the second region R2 afterthe package 90 is manufactured, and is the thickness difference fromwhich the thickness of the plating layer is removed.

Further, the width and thickness of the second region R2 are changed asappropriate depending on the material of the first lead electrode 20 andthe second lead electrode 30, the size of the resin molded body 10 andthe like.

The light emitting element 2 is mounted on the first lead electrode 20of the package 90. The shape or size of the light emitting element 2used herein is not particularly limited. As to the color of lightemitted by the light emitting element 2, an arbitrary wavelength can beselected in accordance with the intended use. For example, as a lightemitting element of blue (wavelength 430 nm to 490 nm), GaN-base orInGaN-base may be employed. The InGaN-base may be InxAlyGa_(1-X-Y)N(0≤X≤1, 0≤Y≤1, X+Y<1) or the like.

The wires W are electrically conductive wires for electricallyconnecting the light emitting element 2 and electrical components suchas a protective element to the first lead electrode 20 and the secondlead electrode 30. The material of the wires W may be metal such as Au(gold), Ag (silver), Cu (copper), Pt (platinum), Al (aluminum) or thelike, and alloy thereof. Particularly, Au being excellent in thermalconductivity and the like is preferable. Note that, the thickness of thewire W is not particularly limited, and can be selected as appropriatein accordance with the purpose and the intended use.

The sealing member 40 is provided in the recess 10 a of the package 90so as to cover the light emitting element 2 and the like. The sealingmember 40 is provided for protecting the light emitting element 2 andthe like from an external force, dust, moisture and the like, and toimprove the heat resistance, weather resistance, and lightfastness ofthe light emitting element 2 and the like. The material of the sealingmember 40 may be a thermosetting resin, e.g., a transparent materialsuch as silicone resin, epoxy resin, urea resin or the like. In additionto such a material, for obtaining a prescribed function, a fluorescentmaterial or filler of a substance exhibiting high light reflectivity maybe added to the sealing member 40.

For example, by mixing the sealing member 40 and a fluorescent material,color-tone adjustment of the light emitting device 1 can be easilyachieved. Note that, such a fluorescent material may be greater inspecific gravity than the sealing member 40, and absorb the light fromthe light emitting element 2 to convert the wavelength. When thefluorescent material is greater in specific gravity than the sealingmember 40, it precipitates toward the first lead electrode 20 and thesecond lead electrode 30 and therefore, it is preferable. Specifically,for example, a yellow fluorescent material such as YAG (Y₃Al₅O₁₂:Ce),silicate or the like, a red fluorescent material such as CASN(CaAlSiN₃:Eu) or KSF (K₂SiF₆:Mn) or the like, or a green fluorescentmaterial such as chlorosilicate, BaSiO₄:Eu²⁺ or the like may be used.

As the filler contained in the sealing member 40, for example, asubstance exhibiting high light reflectivity such as SiO₂, TiO₂, Al₂O₃,ZrO₂, MgO or the like may be suitably used. Further, for the purpose ofcutting undesired wavelengths, for example, an inorganic or organiccoloring dye or coloring pigment may be used.

Second Embodiment

A description will be given of a light emitting device 1A according to asecond embodiment, mainly focusing on the differences from the lightemitting device 1 according to the first embodiment.

FIG. 5 is a schematic diagram of a perspective view showing an entirelight emitting device according to a second embodiment. FIG. 6 is aschematic diagram of a cross-section of the light emitting deviceaccording to the second embodiment taken along line VI-VI in FIG. 5.FIG. 7 is a schematic diagram of a top view of the light emitting deviceaccording to the second embodiment.

In a plan view, the second lead electrode 30 has a fourth region R4, afifth region R5 surrounding a periphery of the fourth region R4 andhaving a thickness greater than that of the fourth region R4, and asixth region R6 surrounding at least a portion of a periphery of thefifth region R5 and having a thickness smaller than that of the fifthregion R5.

The fourth region R4 is the portion subjected to wire bonding. The fifthregion R5 is formed at the boundary between the portion subjected towire bonding and the resin molded body 10 in the second lead electrode30.

Specifically, part of the fifth region R5 is formed along the lateralsurface of the resin molded body 10 forming the lateral surface 10 b ofthe recess 10 a, and part of the fifth region R5 is formed along the gap10 e connecting the first lead electrode 20 and the second leadelectrode 30.

The lateral surface 10 b of the recess 10 a is connected continuously toan outer corner portion of the fifth region R5. That is, in across-sectional view, the lower portion of the lateral surface 10 b ofthe recess 10 a is in contact with the position of the outer cornerportion of the fifth region R5, such that the upper surface of the fifthregion R5 and the lateral surface 10 b of the recess 10 a are continuousto each other.

The sixth region R6 has the same thickness as the fourth region R4.

A width A2 of the fifth region R5 is 110 μm or more. By setting thewidth A2 of the fifth region R5 to 110 μm or more, the fifth region R5can be easily formed. Further, in manufacturing the light emittingdevice 1A, when the width A2 of the fifth region R5 is 110 μm or more,and resin is injected into the mold, provided that the resin flows intofifth region R5, the resin tends to stop midway on the upper surface ofthe fifth region R5. Accordingly, the resin will not easily flow toreach the metal exposed portion on the second lead electrode 30, and theeffect of suppressing generation of resin burrs is enhanced. In order tomore easily achieve the above-described effects, the width A2 of thefifth region R5 is preferably 120 μm or more, and more preferably 130 μmor more.

Note that, the metal exposed portion on the second lead electrode 30 isthe portion on the second lead electrode 30 at the bottom surface 10 cof the recess 10 a excluding the fifth region R5.

Further, the width A2 of the fifth region R5 is preferably 200 μm orless. In manufacturing the light emitting device 1A, when the width A2of the fifth region R5 is 200 μm or less, the pressing force is moreeasily centered at the fifth region R5 when the pair of lead electrodes20 and 30 are pressed by the mold. In order to more easily achieve theabove-described effect, the width A2 of the fifth region R5 is morepreferably 190 μm or less, and further preferably 180 μm or less.

Note that, the width A2 of the fifth region R5 is the width excludingthe thickness of a plating layer. Further, as will be described later,the thicknesses of metal portions 14 formed by the fifth region R5 beingcrushed are not included.

Preferably, the difference between the thickness of the second leadelectrode 30 at the fourth region R4 and the thickness of the secondlead electrode 30 at the fifth region R5 (hereinafter referred to as the“thickness difference”) B2 is from 5 μm to 50 μm inclusive. Inmanufacturing the light emitting device 1A, when the thicknessdifference B2 between the fourth region R4 and the fifth region R5 is 5μm or more, as will be described later, and the pair of lead electrodes20 and 30 are pressed by the mold, the possibility of the upper moldpart being brought into contact with the metal exposed portion of thesecond lead electrode 30 becomes smaller. On the other hand, when thethickness difference B2 between the fourth region R4 and the fifthregion R5 is 50 μm or less, the thickness of the entire pair of leadelectrodes 20 and 30 can be reduced. In order to more easily achieve theeffect described above, the thickness difference B2 between the fourthregion R4 and the fifth region R5 is more preferably 10 μm or more, andfurther preferably 15 μm or more. Further, in order to further easilyachieve the above-described effect, the thickness difference B2 betweenthe fourth region R4 and the fifth region R5 is more preferably 45 μm orless, and further preferably 40 μm or less.

Note that, the thickness difference B2 between the fourth region R4 andthe fifth region R5 in the light emitting device 1A is the thicknessdifference between the fourth region R4 and the fifth region R5 afterthe package 90 is manufactured, and is the thickness difference fromwhich the thickness of the plating layer is removed.

Further, the width and thickness of the fifth region R5 are changed asappropriate depending on the material of the first lead electrode 20 andthe second lead electrode 30, the size of the resin molded body 10 andthe like.

Method of Manufacturing Light Emitting Device

Next, a method of manufacturing the light emitting device according tothe present embodiment will be described. Note that, herein, adescription will be exemplarily given on a method of manufacturing thelight emitting device 1A according to the second embodiment. FIG. 8 is aschematic diagram of a top view of a lead frame in a step ofmanufacturing the light emitting device according to the secondembodiment. FIG. 9 is a schematic diagram of a top view of a lead framein a step of manufacturing the light emitting device according to thesecond embodiment, taken along line IX-IX in FIG. 8. FIG. 10 is aschematic diagram showing an arrangement of lead electrodes and the moldat the position corresponding to line VI-VI in FIG. 5 in a step ofmanufacturing the light emitting device according to the secondembodiment. FIG. 11 is a schematic diagram of a cross-section showingthe lead electrodes placed between and held by the upper mold part andthe lower mold part, in a step of manufacturing a package for mounting alight emitting element according to the second embodiment. FIG. 12 is aschematic diagram of a cross-section of a package after removing themold, in a step of manufacturing the package according to the secondembodiment. FIG. 13 is a schematic diagram of a top view of a packageafter removing the mold, in a step of manufacturing the packageaccording to the second embodiment.

FIG. 14 is a schematic diagram of a cross-section showing state in whicha light emitting element is mounted, in a step of manufacturing thelight emitting device according to the second embodiment. FIG. 15 is aschematic diagram of a second region formed by etching in the lightemitting device according to the second embodiment. FIG. 16 is aschematic cross-sectional view showing the states of the second regionbefore and after being placed between the upper mold part and the lowermold part and pressed by the mold, in a package according to the secondembodiment. FIG. 17 is a schematic cross-sectional view showing torelationship between the second region provided with a metal portion anda sealing member in the light emitting device according to the secondembodiment.

Herein, a description will be given on the case where a single packageis manufactured.

The method of manufacturing the light emitting device 1A according tothe present embodiment includes, as one example, the following first toeighth steps.

The first step is a step of preparing the first lead electrode 20 andthe second lead electrode 30.

The structure of the first lead electrode 20 and the second leadelectrode 30 are as described above, and as shown in FIGS. 8 and 9, thesecond region R2 and the fifth region R5 are previously formed.

The second region R2 and the fifth region R5 can be formed by subjectingthe base material itself of the metal plates to work such as, forexample, etching or pressing.

When the second region R2 and the fifth region R5 are formed by etching,the pair of lead electrodes 20 and 30 are covered by a mask of aprescribed shape, and immersed in etchant. Therefore, the lateralsurface of the second region R2 and the fifth region R5 become slightlyrounded (see FIG. 15). On the other hand, when the second region R2 andthe fifth region R5 are formed by pressing, the lateral surface of thesecond region R2 and the fifth region R5 become perpendicular andprovided with corners (see FIG. 6).

Further, the second region R2 and the fifth region R5 crush when pressedby the mold, depending on the pressing pressure. Therefore, thethickness of the second region R2 and the fifth region R5 is preferablydesigned such that the thickness difference B1 between the first regionR1 and the second region R2 and the thickness difference B2 between thefourth region R4 and the fifth region R5 become 5 μm to 50 μm inclusive,taking into consideration the pressing pressure in pressing.

Then, prior to performing the second step, as shown in FIG. 10, thefirst lead electrode 20 and the second lead electrode 30 are arrangedbetween the upper mold part 70 and the lower mold part 71. The firstlead electrode 20 and the second lead electrode 30 are arranged as beingspaced apart from each other by the gap 10 e (see FIG. 2) for preventingshort-circuiting. Note that, the upper mold part 70 has a projection 75corresponding to the shape of the recess 10 a, in order to form therecess 10 a for storing the light emitting element 2 by the pair of leadelectrodes 20 and 30 and the resin molded body 10.

The second step is a step of, for example, using a package-manufacturingpurpose mold K, pressing the pair of lead electrodes 20 and 30 so as toallow the second region R2 and the fifth region R5 to abut the uppermold part 70. Here, as shown in FIG. 11, the first lead electrode 20 andthe second lead electrode 30 are pressed between the upper mold part 70and the lower mold part 71.

Specifically, a bottom surface 75 a formed at the projection 75 of theupper mold part 70 abuts the second region R2 of the first leadelectrode 20 and the fifth region R5 of the second lead electrode 30.Thus, by the upper mold part 70 and the lower mold part 71, cavities 80and 81 are formed.

In the second step, the first lead electrode 20 and the second leadelectrode 30 are pressed by the mold with a pressing force with whichcontact between the bottom surface 75 a formed at the projection 75 ofthe upper mold part 70 and the metal exposed portion of the first leadelectrode 20 and the metal exposed portion of the second lead electrode30 is avoided. At this time, though the second region R2 and the fifthregion R5 crush when being pressed, depending on the pressing pressure,the bottom surface 75 a does not abut the metal exposed portion of thefirst lead electrode 20, and hence a cavity 82 is formed. Similarly,since the bottom surface 75 a does not abut the metal exposed portion ofthe second lead electrode 30, a cavity 83 is formed.

In the second step, pressing is preferably performed such that thethickness difference B1 between the first region R1 and the secondregion R2 and the thickness difference B2 between the fourth region R4and the fifth region R5 in the manufactured light emitting device 1Abecome 5 μm to 50 μm inclusive.

The third step is a step of injecting resin into thepackage-manufacturing purpose mold K pressing the pair of leadelectrodes 20 and 30. Herein, the resin is injected into the cavities 80and 81 formed by the upper mold part 70 and the lower mold part 71 froman injection port 77 by transfer molding. In the third step, since thefirst lead electrode 20 and the second lead electrode 30 are pressed bythe upper mold part 70 and the lower mold part 71, the first leadelectrode 20 and the second lead electrode 30 do not flap when the resinis injected. Thus, generation of burrs can be suppressed. Note that,since the pair of lead electrodes 20 and 30 are provided with the secondregion R2 and the fifth region R5, the resin is less prone to enter thecavities 82 and 83.

The fourth step is a step of forming the resin molded body 10 by curingthe resin injected into the package-manufacturing purpose mold K.Herein, when thermosetting resin such as epoxy resin is injected as theresin, for example, the upper mold part 70 and the lower mold part 71are heated to thereby heat the resin for a prescribed period, to allowthe resin to cure. Note that, when thermoplastic resin such aspolyphthalamide resin, for example, is injected, molding can be achievedthrough injection molding. In this case, the thermoplastic resin may bemelted under high temperatures, and put into a low-temperature mold andallowed to cure by being cooled.

The fifth step is a step of removing the upper mold part 70 and thelower mold part 71. Herein, for example as shown in FIG. 12, the uppermold part 70 and the lower mold part 71 are removed. Thus, as shown inFIGS. 12 and 13, the package in which the first lead electrode 20 andthe second lead electrode 30 are integrally retained by the resin moldedbody 10 is completed.

Note that, when the resin is cured in the fourth step, a gate is moldedat the injection port 77 portion of the mold. This gate is cut by aknown cutting machine along the outer surface 11 a of the resin moldedbody 10 after the mold is removed (the fifth step).

Note that, FIGS. 12 and 13 show the package after the gate is cut off.

The sixth step is a step of mounting the light emitting element 2 in therecess 10 a formed at the package 90. In the present embodiment, thelight emitting element 2 is an element having the one-surface electrodestructure in which a pair of n-electrode and p-electrode are formed onthe upper surface. In this case, as shown in FIG. 14, the back surfaceof the light emitting element 2 is bonded to the first lead electrode 20by an insulating die-bonding member 45. One electrode on the uppersurface of the light emitting element 2 is connected to the first leadelectrode 20 by the wire W, and the other electrode on the upper surfaceof the light emitting element 2 is connected to the second leadelectrode 30 by the wire W.

The seventh step is a step of packing the sealing member 40 into therecess 10 a of the package 90 so as to cover the light emitting element2. Here, as shown in FIG. 14, the sealing member 40 is applied insidethe recess 10 a surrounded by the resin molded body 10 of the package90, to thereby seal the light emitting element 2. At this time, thesealing member 40 is dripped to reach the upper surface of the recess 10a of the resin molded body 10. The sealing member 40 may be packed intothe recess 10 a of the resin molded body 10 by, for example, injection,compression, or extrusion. It is preferable that a fluorescent materialis previously mixed with the sealing member 40. Thus, the color of thelight emitting device can be adjusted easily.

The eighth step is a step of curing the sealing member 40 packed intothe recess 10 a. Here, when thermosetting resin such as silicone resin,for example, is injected as the sealing member 40, the resin is heatedfor a prescribed period and cured.

Through the foregoing steps, the light emitting device 1A can be formed.

In the embodiment described above, the case where a single package ismanufactured has been shown. However, it is also possible to employ alead frame in which a plurality of pairs of metal plates, each pair ofmetal plates being the pair of the first lead electrode 20 and thesecond lead electrode 30, are connected by suspension leads. In thiscase, the pair of metal plates on the lead frame are referred to as thefirst lead electrode 20 and the second lead electrode 30.

Then, in the case where the lead frame in which a plurality of pairs ofmetal plates are connected is employed, the following ninth step isperformed following the above-described first to eighth steps.

The ninth step is a step of cutting off the package 90 from the leadframe. Herein, the resin molded body 10 and the pair of lead electrodes20 and 30 are cut off from the lead frame, whereby the package 90 issingulated. Here, for example, a lead cutter may be used as a jig forcutting the suspension leads of the lead frame.

Thus, the light emitting device 1A can be formed.

Note that, in the above-described manufacturing method, the method ofmanufacturing the light emitting device 1A according to the secondembodiment has been described. On the other hand, in the case where thelight emitting device 1 according to the first embodiment ismanufactured, the second lead electrode 30 that is not provided with thefifth region R5 is used. Accordingly, in the second step, the bottomsurface 75 a formed at the projection 75 of the upper mold part 70 isbrought into contact with the second lead electrode 30, and the cavity83 is not formed. The rest of the process is similar to the method ofmanufacturing the light emitting device 1A.

As has been described in the foregoing, with the method of manufacturinga package employed for manufacturing the package according to theembodiments, as shown in FIGS. 11 and 12, the first lead electrode 20and the second lead electrode 30 are pressed by the upper mold part 70and the lower mold part 71. When the resin is injected, the pressed areais smaller than that in the case where the second region R2 and thefifth region R5 do not exist at the lead electrodes. Accordingly, thepressing force is centered at the second region R2 and the fifth regionR5, and the upper mold part 70 and the lower mold part 71 are broughtinto intimate contact with the first lead electrode 20 and the secondlead electrode 30.

Accordingly, the resin will not easily flow into the cavities 82 and 83,that is, onto the metal exposed portions on the first lead electrode 20and the second lead electrode 30. Thus, with the package and the lightemitting device according to the second embodiment, generation of burrscan be suppressed.

Accordingly, a step of removing burrs of the bottom surface 10 c of therecess 10 a, which is otherwise conventionally required after the stepof molding the package, can be eliminated. Therefore, according to themethods of manufacturing the package and the light emitting deviceaccording to the embodiments of the invention, the package and the lightemitting device with which generation of burrs can be suppressed can bemanufactured easily. As a result, a reduction in costs and lead time canbe achieved.

In addition, in the conventional case where the second region R2 and thefifth region R5 do not exist at the lead electrodes, when the lead frameis pressed by the mold, marks resulting from the work using the moldremain, and the degree of a shine of the plating of the first leadelectrode 20 and the second lead electrode 30 is changed by the pressingpressure and heat of the mold. Accordingly, even when the degree of ashine of the plating of the first lead electrode 20 and the second leadelectrode 30 is increased before molding, the degree of a shine isreduced after molding. Then, the luminous flux of the LED is reduced,and the output is also reduced.

However, since the second region R2 and the fifth region R5 exist at thefirst lead electrode 20 and the second lead electrode 30 according tothe second embodiment of the invention, the bottom surface 75 a formedat the projection 75 of the upper mold part 70 will not be brought intocontact with the metal exposed portions of the first lead electrode 20and the second lead electrode 30. Therefore, molding can be achievedwithout reducing the degree of a shine of the plating of the first leadelectrode 20 and the second lead electrode 30. Thus, the conventionalproblem of a reduction in the output of the LED can be solved.

Further, since the second region R2 and the fifth region R5 exist at thefirst lead electrode 20 and the second lead electrode 30, the areapressed by the mold is smaller than that in the conventional case. Sincethe pressing pressure is centered at the second region R2 and the fifthregion R5, the number of LEDs that can be manufactured from one leadframe can be increased.

Still further, since the pressing pressure is centered only at thesecond region R2 and the fifth region R5, the pressing pressure of thepackage-manufacturing purpose mold K itself can be reduced, for example,to about half as great as that of the conventional mold. As a result,the effect of an increase in the life of the mold apparatus can also beattained.

Still further, since the second region R2 and the fifth region R5 areformed at the first lead electrode 20 and the second lead electrode 30,the contact area relative to the sealing member 40 increases, wherebyadhesion to the sealing member 40 improves. Still further, as shown inFIG. 16, since the second region R2 and the fifth region R5 crush whenbeing pressed, part of the metal of the second region R2 and the fifthregion R5 squeezes out in the lateral direction, to form a metal portion14. As shown in FIG. 17, by the sealing member 40 entering below themetal portion 14, the sealing member 40 is prevented from coming offupward. Note that, the annular shape of the second region R2 and thefifth region R5 also contribute to preventing the sealing member 40 fromcoming off.

Still further, since the package 90 is molded without reducing thedegree of a shine of the plating of the metal exposed portions of thefirst lead electrode 20 and the second lead electrode 30 exposed at therecess 10 a, a reduction in the luminous flux of the light emittingdevice can be suppressed, and a reduction in the output can beprevented.

Still further, since the second region R2 exists at the first leadelectrode 20, flow-out (bleeding) of the die-bonding member 45 inmounting the light emitting element 2 can be suppressed. In particular,when a plurality of light emitting elements 2 are mounted, flow-out ofthe die-bonding member 45 in the lateral direction becomes a concern.However, when the width A1 of the second region R2 is 110 μm or more,the die-bonding member 45 will not easily flow over the second regionR2.

Still further, the effect achieved by the light emitting device 1Aaccording to the second embodiment described above can also be achievedby the light emitting device 1 according to the first embodiment, exceptfor the effect achieved by the light emitting device 1A having the fifthregion R5.

EXAMPLE Example 1

In the following, Example 1 of the present invention will be described.Molding was performed using, as shown in FIG. 6, the first leadelectrode 20 and the second lead electrode 30 having a width of 150 μmand a height of 25 μm in the second region R2 and the fifth region R5,using a transfer molding machine.

The molding was performed under the conventional pressing pressure andinjection pressure conditions with which resin burrs were generated whenmolding was performed using lead electrodes of a conventional shapewithout the second region R2 and the fifth region R5. Then, whether ornot burrs were produced was checked.

As a result, it was found that burrs were not generated at the metalexposed portions of the first lead electrode 20 and the second leadelectrode 30, with the first lead electrode 20 and the second leadelectrode 30 provided with the second region R2 and the fifth region R5.

Further, it was found that the bottom surface 75 a formed at theprojection 75 of the upper mold part 70 was not brought into contactwith the metal exposed portion of the second lead electrode 30 exposedat the recess 10 a of the package 90. This metal exposed portion is thecentral portion of the second lead electrode 30 excluding the fifthregion R5.

Still further, it was found that the bottom surface 75 a formed at theprojection 75 of the upper mold part 70 was not brought into contactwith the metal exposed portion of the first lead electrode 20 exposed atthe recess 10 a of the package 90. This metal exposed portion is thecentral portion of the first lead electrode 20 excluding the secondregion R2.

Note that, as to the first lead electrode 20 and the second leadelectrode 30 provided with the second region R2 and the fifth region R5,formation of the second region R2 and the fifth region R5 was easilyperformed.

Variations

Next, a description will be given of Variations of the light emittingdevice according to the present embodiment.

Variation 1

FIG. 18 is a schematic diagram of a cross-section of lead electrodesprovided with lateral surface protrusion portions respectively accordingto Variation 1. FIG. 19 is a schematic diagram of a top view of the leadelectrodes provided with lateral surface protrusion portionsrespectively according to Variation 1.

As shown in FIGS. 18 and 19, the first lead electrode 20 and the secondlead electrode 30 may be respectively provided with lateral surfaceprotrusions 8 and 9 that are protrusions formed in the width directionof respective lateral surfaces opposing each other, at the center in theheight direction of the lateral surfaces. That is, the first leadelectrode 20 and the second lead electrode 30 respectively have thelateral surface protrusions 8 and 9 protruding in the horizontaldirection at the sites where the pair of lead electrodes 20 and 30 areconnected by the resin molded body 10.

The lateral surface protrusion 8 of the first lead electrode 20 isformed by a prescribed thickness at the center in the height directionin a cross-sectional view. Further, in a top view, the lateral surfaceprotrusion 8 of the first lead electrode 20 is formed in the widthdirection of the first lead electrode 20, that is, in parallel with thelongitudinal direction of the gap 10 e connecting the first leadelectrode 20 and the second lead electrode 30, in the entire widthdirection of the first lead electrode 20.

The lateral surface protrusion 9 of the second lead electrode 30 isformed by a prescribed thickness at the center in the height directionin a cross-sectional view. Further, in a top view, the lateral surfaceprotrusion 9 of the second lead electrode 30 is formed in the widthdirection of the second lead electrode 30, that is, in parallel with thelongitudinal direction of the gap 10 e connecting he first leadelectrode 20 and the second lead electrode 30, in the entire widthdirection of the second lead electrode 30.

The lateral surface protrusions 8 and 9 can be formed in the first leadelectrode 20 and the second lead electrode 30, for example, bysubjecting the base material itself of the metal plates to work, forexample, of etching or pressing.

By providing the lateral surface protrusions 8 and 9 with the package90, adhesion between the first lead electrode 20, the second leadelectrode 30 and the resin molded body 10 improves, and the first leadelectrode 20 and the second lead electrode 30 are more firmly fixed toeach other.

Note that, the thickness and length of the lateral surface protrusions 8and 9 are not particularly limited, and should be adjusted asappropriate.

Variation 2

FIG. 20 is schematic a cross-sectional view of the second regionprovided with a groove, showing a state before and after being placedbetween the upper mold part and the lower mold part and pressed by themold according to Variation 2.

The light emitting device may have a groove 15 formed along thelongitudinal direction of the second region R2 (i.e., the directionperpendicular to the surface of FIG. 20, and the direction extendingalong the periphery of the bottom surface 10 c of the recess 10 a) atthe tip of the second region R2, and a groove 15 formed along thelongitudinal direction of the fifth region R5 at the tip of the fifthregion R5.

The second region R2 and the fifth region R5 are each provided with thegroove 15 of prescribed depth and shape formed along the longitudinaldirection of the second region R2 and the fifth region R5 at the centerin the width direction of the upper surface. In each groove 15, metal isburied, the metal resulting from the second region R2 and the fifthregion R5 being crushed and squeezed out in the lateral direction whenpressing is performed with a pressing force of a magnitude with whichthe second region R2 and the fifth region R5 crush.

In such a method of manufacturing the light emitting device, firstly, inthe step of preparing the pair of lead electrodes 20 and 30, the groove15 is formed at the tip of each of the second region R2 and the fifthregion R5. Then, when the pair of lead electrodes 20 and 30 are pressed,depending on the pressing pressure, the second region R2 and the fifthregion R5 crush, and part of the metal of the second region R2 and thefifth region R5 squeezes out in the lateral direction. Thus, thesqueezed out metal is buried in the groove 15, whereby production of themetal portion 14 outside the second region R2 and the fifth region R5 isprevented. Accordingly, while the groove 15 in which metal is buriedremains at each of the second region R2 and the fifth region R5 in themanufactured package, the second region R2 and the fifth region R5 willnot have the metal portion 14.

Accordingly, in the light emitting device, when it is desired to keepthe shape of the second region R2 and the fifth region R5, the groove 15is preferably formed at the tip of each of the second region R2 and thefifth region R5.

The depth, shape, position to be formed and the like of the groove 15are not limited, and should be adjusted as appropriate.

Variation 3

FIG. 21 is a schematic diagram of a cross-section of a light emittingdevice according to Variation 3 in which a die-bonding member is filledin a region for mounting a light emitting element.

The light emitting device may be structured such that the sealing member40 contains a first fluorescent material, and resin containing a secondfluorescent material that is different from the first fluorescentmaterial in the emission wavelength is packed in the region for mountingthe light emitting element 2.

For example, as the first fluorescent material, a fluorescent materialemitting green-color light is mixed with the sealing member 40. As thesecond fluorescent material, a fluorescent material emitting red-colorlight is mixed with the die-bonding member 45. Then, the die-bondingmember 45 containing the second fluorescent material is packed in theregion for mounting the light emitting element 2 (the metal exposedportion of the first lead electrode 20), and the light emitting element2 is mounted. Thereafter, the sealing member 40 containing the firstfluorescent material is packed in the recess 10 a of the package 90, toobtain the light emitting device. Thus, the light emitting device beinga bright white-color light source can be obtained. Note that, as shownin FIG. 21, the die-bonding member 45 containing the fluorescentmaterial can also be packed in the metal exposed portion of the secondlead electrode 30.

The type and combination of the first fluorescent material and thesecond fluorescent material should be selected as appropriate asdesired.

Other Variations

Further, the lateral surface of the second region R2 and the fifthregion R5 on the metal exposed surface side may be inclined outward frombottom to top in a cross-sectional view. Such a structure improves thelight extracting efficiency.

The recess 10 a of the package 90 may be formed into an ellipticallycylindrical shape without being tilted. Further, the lateral surface 10b of the recess 10 a may not necessarily be flat. It is also possible tomold the lateral surface 10 b to have an uneven surface, such that theadhesion at the interface between the resin molded body 10 and thesealing member 40 improves. Further, though the recess 10 a is molded tobe elliptical in a plan view in the present embodiment, it may be moldedto be circular in other embodiments. Still further, though the resinmolded body 10 is molded to be rectangular in the present embodiment,the resin molded body 10 may be molded to have a circular, elliptical,or other polygonal shape in a plan view in other embodiments.

The lead electrodes should be provided, as in the present embodiment, byat least a pair of positive and negative electrodes (the first leadelectrode 20 and the second lead electrode 30). However, it is alsopossible that three or more lead electrodes are provided.

The light emitting element 2 can be mounted on the second lead electrode30 in place of the first lead electrode 20. When the light emittingdevice includes, for example, two light emitting elements 2, the lightemitting elements 2 may be respectively mounted on the first leadelectrode 20 and the second lead electrode 30. A protective element maybe mounted on an inner lead portion where the light emitting element isnot mounted. For example, by setting the width of the second region R2and the fifth region R5 to 110 μm or more, a protective element can bemounted on the second region R2 of the first lead electrode 20 or on thefifth region R5 of the second lead electrode 30.

The light emitting element 2 may be an element having the oppositeelectrode structure (the double-surface electrode structure) in which,for example, the n-electrode (or the p-electrode) is formed on the backsurface of the element substrate. Further, the light emitting element 2is not limited to the face-up type, and may be the face-down type. Withthe light emitting element of the face-down type, the wires can bedispensed with.

In the method of manufacturing the light emitting device, when a leadframe in which a plurality of pairs of metal plates being the pairs ofthe first lead electrode 20 and the second lead electrode 30 areconnected by suspension leads is used, the light emitting element 2 arepreviously mounted on the package 90 and thereafter singulated. However,the light emitting element 2 may be mounted on the singulated package90.

The position where the wire W is connected may be the upper surface ofeach of the second region R2 and the fifth region R5. In suspending thewire W, the wire W can be more easily suspended when the heightdifference between the upper surface of the light emitting element 2 andthe position where the wire W is suspended is smaller, that is, when theposition where the wire W is suspended is high. Note that, since thewidth of the second region R2 and the fifth region R5 is 110 μm or more,the wire W is easily connected when the wire W is connected to the uppersurface of the second region R2 and the fifth region R5.

The light emitting device of the present embodiments is applicable for abacklight light source of a liquid crystal display, various illuminationdevices, various display apparatuses such as a large-screen display, anadvertisement, a destination guide and the like, and furthermore, animage reading apparatus in a digital video camera, a facsimile, acopier, a scanner and the like, a projector apparatus and the like.

As shown in the above descriptions, a package for mounting a lightemitting element, a light emitting device, and methods of manufacturingthe package and the light emitting device in accordance with therepresentative embodiments have been described herein, but the scope ofthe invention is not limited to the above description, and should bewidely understood based on the scope of the claims. Further, based onthe above description, it will be obvious that various changes andmodifications can be made therein without departing from the scope ofthe embodiments of the invention.

What is claimed is:
 1. A package for mounting a light emitting elementcomprising: a first lead electrode defining a portion of a bottom of arecess, wherein the first lead electrode comprises a base member and aplating disposed on the base member, and wherein the first leadelectrode comprises, in a plan view: a first region, a second regionsurrounding a periphery of the first region, wherein, in a heightdirection, an upper surface of the base member in an entirety of thesecond region is higher than an upper surface of the base member in thefirst region, and a third region surrounding at least a portion of aperiphery of the second region, wherein, in the height direction, anupper surface of the base member in the third region is lower than theupper surface of the base member in the entirety of the second region; asecond lead electrode arranged spaced apart from the first leadelectrode and defining a portion of the bottom of the recess; and aresin molded body fixing a portion of the first lead electrode and aportion of the second lead electrode, wherein the resin molded body hasa lateral surface defining at least a portion of a lateral side of therecess.
 2. The package according to claim 1, wherein an upper surface ofthe base member of the first lead electrode in the first region iscoplanar with the upper surface of the base member of the first leadelectrode in the third region.
 3. The package according to claim 1,wherein a portion of an upper surface of the second region of the firstlead electrode is continuous with a portion of the lateral surface ofthe resin molded body.
 4. The package according to claim 1, wherein adifference between a thickness of the first region of the first leadelectrode and a thickness of the second region of the first leadelectrode is in a range of 5 μm to 50 μm.
 5. The package according toclaim 1, wherein the second lead electrode comprises a base member and aplating disposed on the base member, and wherein the second leadelectrode comprises, in a plan view: a fourth region, a fifth regionsurrounding a periphery of the fourth region, wherein, in a heightdirection, an upper surface of the base member of the second electrodein an entirety of the fifth region is higher than an upper surface ofthe base member of the second electrode in the fourth region, and asixth region surrounding at least a portion of a periphery of the fifthregion, wherein, in the height direction, an upper surface of the basemember in the sixth region is lower than the upper surface of the basemember in the entirety of the fifth region.
 6. The package according toclaim 5, wherein the fifth region has a width of 110 μm or more.
 7. Thepackage according to claim 1, wherein the second region comprises ametal portion at an outer periphery.
 8. The package according to claim7, wherein the metal portion is embedded in the resin molded body. 9.The package according to claim 1, wherein a width of the second regionis 110 μm or more.
 10. The package according to claim 1, wherein thesecond region is a region formed by etching.
 11. The package accordingto claim 1, wherein the second region is a region formed by pressing.12. The light emitting device according to claim 1, wherein the resinmolded body has an inclined lateral surface defining at least a portionof a lateral side of the recess wherein the inclined lateral surface isinclined in a direction upward and outward from the bottom of therecess.
 13. The light emitting device according to claim 12, wherein theinclined lateral surface extends from the bottom of the recess to anuppermost surface of the resin molded body.
 14. The light emittingdevice according to claim 1, wherein an outer lateral surface of thefirst lead electrode in the second region includes a first protrudingportion that protrudes such that a part of the resin molded body islocated under the first protruding portion.
 15. A light emitting devicecomprising: the package according to claim 1; and a light emittingelement mounted on the first region.
 16. The light emitting deviceaccording to claim 15, further comprising a sealing member located inthe recess so as to cover the light emitting element.